We provide precision glass drilling and hole processing — through-holes, countersunk holes, stepped holes, mounting holes, and instrument cut-outs — on CNC machining centres that hold hole and cut-out position to ±0.2 mm. A hole is a deliberate stress concentrator in a brittle material, so hole diameter, edge distance, and hole-to-hole spacing are engineered to standard rules to ensure the panel survives tempering and service.
Standard diamond drilling produces clean holes down to about 2 mm; for smaller diameters or very thin glass, laser and ultrasonic drilling are used. On thick and special-glass stock such as borosilicate, deep-hole and multi-hole patterns are produced in the same machining setup, keeping every hole on one coordinate reference so position accuracy is preserved across the panel.
| Parameter | Specification |
|---|---|
| Hole types | Through, countersunk, stepped, mounting, instrument |
| Minimum diameter | ≈2 mm (diamond); smaller via laser / ultrasonic |
| Cut-outs | U-notch, hinge, slot, corner notch |
| Position tolerance | ±0.2 mm |
| Method | Twin-face diamond; laser / ultrasonic for fine or thin work |
| Special glass | Deep-hole and multi-hole patterns on borosilicate and ceramic |
| Sequence | Drilled before tempering |
Provide a hole table or drawing with diameters, positions from datum, countersink/step dimensions, and final thickness for a quotation.